| SMT Capacity | |
| SMT Item | Capacity |
| PCB Max. size | 510mm*1200mm(SMT) |
| Chip component | 0201, 0402, 0603, 0805,1206 package |
| Min.pin space of IC | 0.1mm |
| Min. space of BGA | 0.1mm |
| Max.precision of IC assembly | ±0.01mm |
| Assembly capacity | ≥8 million piots/day |
| DIP capacity | 6 DIP production lines |
| Assembly testing | Bridge test,AOI test, X-Ray test, ICT(In Circuit Test),FCT(Functional Circuit Test) |
FCT(Functional Circuit Test) | Current test, voltage test, high temperature and low temperature test,Drop Impact Test,aging test,water proof test,leakage-proof test and etc.Different test can be done according to your requirement. |
